Sec. 4. In authorizing the issuance of bonds for any building facility or facilities, the board of the issuing state educational institution may:
(1) limit the amount of bonds that may be issued as a first lien and charge against the property, fees, income, and funds; and
(2) provide, after the original issuance of bonds, for the issuance of additional bonds secured by the same lien to provide funds to:
(A) pay the cost of acquiring, erecting, constructing, reconstructing, improving, rehabilitating, remodeling, repairing, completing, extending, enlarging, equipping, or furnishing the building facility or facilities for which the original bonds were issued;
(B) provide funds to pay the cost of additional building facilities under this article; or
(C) perform actions under both clauses (A) and (B).
[Pre-2007 Higher Education Recodification Citation: 20-12-6-6(c).]
As added by P.L.2-2007, SEC.275.